Hawaiian Electric Company, INC. 6% 2033 bond (US419866AV08)
As of 2026-10-27 · rebuilt daily
https://bondscovery.com/bond/US419866AV08
Hawaiian Electric Company, INC.'s 6% USD bond maturing 2033-10-01 (US419866AV08) yields 6.99% to worst as of 2026-10-27. That is 208 bp over the US Treasury curve at the same maturity and 22 bp above the fitted United States High Yield (BB–D) Utilities & Power Corporate Bond (USD) curve.
Against its curves
Each curve's fitted yield at this bond's maturity (at its call date, where it is priced to call), and the bond's spread to it.
| Curve | Curve yield | Spread |
|---|---|---|
| US Treasury Yields | 4.90% | +208 bp |
| United States High Yield (BB–D) Utilities & Power Corporate Bond Yields (USD) | 6.77% | +22 bp |
| US High Yield (BB–D) Utilities & Power Corporate Bond Yields (USD) | 7.10% | -11 bp |
| United States High Yield (BB–D) Corporate Bond Yields (USD) | 6.82% | +16 bp |
| US High Yield (BB–D) Corporate Bond Yields (USD) | 7.04% | -5 bp |
The bond
| ISIN | US419866AV08 |
|---|---|
| Issuer | Hawaiian Electric Company, INC. |
| Issuer type | Corporate |
| Country | United States |
| Sector | Utilities & Power |
| Currency | USD |
| Coupon | 6% |
| Coupon frequency | Semiannual |
| Maturity | 2033-10-01 |
| Rating band | BB+–D (High Yield) |
| Yield to worst | 6.99% |