bondScoverySTUDIO

IBM Intl Capital 4.75% 2031 bond (US449276AD68)

As of 2026-10-27 · rebuilt daily

https://bondscovery.com/bond/US449276AD68

IBM Intl Capital's 4.75% USD bond maturing 2031-02-05 (US449276AD68) yields 5.51% to worst as of 2026-10-27. That is 70 bp over the US Treasury curve at the same maturity and 17 bp above the fitted Singapore Investment Grade Corporate Bond (USD) curve.

View this bond liveSingapore Investment Grade Corporate Bond (USD) curve
5%5.5%6%3M12M2Y5Y10Y20Y30Y50Y
Fitted curve (line), the bonds it is fitted on (dots) and this bond (magenta). Click to open it in the interactive chart.

Against its curves

Each curve's fitted yield at this bond's maturity (at its call date, where it is priced to call), and the bond's spread to it.

CurveCurve yieldSpread
US Treasury Yields4.82%+70 bp
IBM Intl Capital Bond Yields (USD)5.45%+7 bp
Singapore Investment Grade Corporate Bond Yields (USD)5.34%+17 bp
US A–BBB Technology, Media & Telecom Corporate Bond Yields (USD)5.62%-10 bp
US Investment Grade Technology, Media & Telecom Corporate Bond Yields (USD)5.63%-11 bp
US A–BBB Corporate Bond Yields (USD)5.57%-6 bp
US Investment Grade Corporate Bond Yields (USD)5.56%-4 bp

The bond

ISINUS449276AD68
IssuerIBM Intl Capital
Issuer typeCorporate
CountrySingapore
SectorTechnology, Media & Telecom
CurrencyUSD
Coupon4.75%
Coupon frequencySemiannual
Maturity2031-02-05
Rating bandA+–BBB- (Investment Grade)
Yield to worst5.51%