S&P Global 2.45% 2027 bond (US78409VBH69)
As of 2026-10-27 · rebuilt daily
https://bondscovery.com/bond/US78409VBH69
S&P Global's 2.45% USD bond maturing 2027-03-01 (US78409VBH69) yields 4.43% to worst as of 2026-10-27. That is 25 bp over the US Treasury curve at the same maturity and 56 bp below the fitted United States A–BBB Financial Services (ex Banks) Corporate Bond (USD) curve.
Against its curves
Each curve's fitted yield at this bond's maturity (at its call date, where it is priced to call), and the bond's spread to it.
The bond
| ISIN | US78409VBH69 |
|---|---|
| Issuer | S&P Global |
| Issuer type | Corporate |
| Country | United States |
| Sector | Financial Services (ex Banks) |
| Currency | USD |
| Coupon | 2.45% |
| Coupon frequency | Semiannual |
| Maturity | 2027-03-01 |
| Rating band | A+–BBB- (Investment Grade) |
| Yield to worst | 4.43% |