Dish DBS 7.375% 2028 bond (US25470XBB01)
As of 2026-10-30 · rebuilt daily
https://bondscovery.com/bond/US25470XBB01
Dish DBS's 7.375% USD bond maturing 2028-07-01 (US25470XBB01) yields 9.35% to worst as of 2026-10-30. That is 471 bp over the US Treasury curve at the same maturity and 276 bp above the fitted United States High Yield (BB–D) Technology, Media & Telecom Corporate Bond (USD) curve.
View this bond liveUnited States High Yield (BB–D) Technology, Media & Telecom Corporate Bond (USD) curve
Against its curves
Each curve's fitted yield at this bond's maturity (at its call date, where it is priced to call), and the bond's spread to it.
| Curve | Curve yield | Spread |
|---|---|---|
| US Treasury Yields | 4.63% | +471 bp |
| United States High Yield (BB–D) Technology, Media & Telecom Corporate Bond Yields (USD) | 6.59% | +276 bp |
| US High Yield (BB–D) Technology, Media & Telecom Corporate Bond Yields (USD) | 7.42% | +193 bp |
| United States High Yield (BB–D) Corporate Bond Yields (USD) | 6.33% | +302 bp |
| US High Yield (BB–D) Corporate Bond Yields (USD) | 6.41% | +294 bp |
The bond
| ISIN | US25470XBB01 |
|---|---|
| Issuer | Dish DBS |
| Issuer type | Corporate |
| Country | United States |
| Sector | Technology, Media & Telecom |
| Currency | USD |
| Coupon | 7.375% |
| Coupon frequency | Semiannual |
| Maturity | 2028-07-01 |
| Rating band | BB+–D (High Yield) |
| Yield to worst | 9.35% |