Dish DBS 5.125% 2029 bond (US25470XBD66)
As of 2026-10-30 · rebuilt daily
https://bondscovery.com/bond/US25470XBD66
Dish DBS's 5.125% USD bond maturing 2029-06-01 (US25470XBD66) yields 9.11% to worst as of 2026-10-30. That is 438 bp over the US Treasury curve at the same maturity and 236 bp above the fitted United States High Yield (BB–D) Technology, Media & Telecom Corporate Bond (USD) curve.
View this bond liveUnited States High Yield (BB–D) Technology, Media & Telecom Corporate Bond (USD) curve
Against its curves
Each curve's fitted yield at this bond's maturity (at its call date, where it is priced to call), and the bond's spread to it.
| Curve | Curve yield | Spread |
|---|---|---|
| US Treasury Yields | 4.72% | +438 bp |
| United States High Yield (BB–D) Technology, Media & Telecom Corporate Bond Yields (USD) | 6.75% | +236 bp |
| US High Yield (BB–D) Technology, Media & Telecom Corporate Bond Yields (USD) | 7.63% | +147 bp |
| United States High Yield (BB–D) Corporate Bond Yields (USD) | 6.43% | +268 bp |
| US High Yield (BB–D) Corporate Bond Yields (USD) | 6.54% | +256 bp |
The bond
| ISIN | US25470XBD66 |
|---|---|
| Issuer | Dish DBS |
| Issuer type | Corporate |
| Country | United States |
| Sector | Technology, Media & Telecom |
| Currency | USD |
| Coupon | 5.125% |
| Coupon frequency | Semiannual |
| Maturity | 2029-06-01 |
| Rating band | BB+–D (High Yield) |
| Yield to worst | 9.11% |