Qualcomm 1.3% 2028 bond (US747525BN20)
As of 2026-10-27 · rebuilt daily
https://bondscovery.com/bond/US747525BN20
Qualcomm's 1.3% USD bond maturing 2028-05-20 (US747525BN20) yields 4.92% to worst as of 2026-10-27. That is 26 bp over the US Treasury curve at the same maturity and 37 bp below the fitted United States A–BBB Technology, Media & Telecom Corporate Bond (USD) curve.
Against its curves
Each curve's fitted yield at this bond's maturity (at its call date, where it is priced to call), and the bond's spread to it.
The bond
| ISIN | US747525BN20 |
|---|---|
| Issuer | Qualcomm |
| Issuer type | Corporate |
| Country | United States |
| Sector | Technology, Media & Telecom |
| Currency | USD |
| Coupon | 1.3% |
| Coupon frequency | Semiannual |
| Maturity | 2028-05-20 |
| Rating band | A+–BBB- (Investment Grade) |
| Yield to worst | 4.92% |