Qualcomm 5% 2035 bond (US747525BW29)
As of 2026-10-27 · rebuilt daily
https://bondscovery.com/bond/US747525BW29
Qualcomm's 5% USD bond maturing 2035-05-20 (US747525BW29) yields 5.70% to worst as of 2026-10-27. That is 79 bp over the US Treasury curve at its call date and 39 bp below the fitted United States A–BBB Technology, Media & Telecom Corporate Bond (USD) curve.
Against its curves
Each curve's fitted yield at this bond's maturity (at its call date, where it is priced to call), and the bond's spread to it.
The bond
| ISIN | US747525BW29 |
|---|---|
| Issuer | Qualcomm |
| Issuer type | Corporate |
| Country | United States |
| Sector | Technology, Media & Telecom |
| Currency | USD |
| Coupon | 5% |
| Coupon frequency | Semiannual |
| Maturity | 2035-05-20 |
| Next call | 2035-02-20 |
| Rating band | A+–BBB- (Investment Grade) |
| Yield to worst | 5.70% |
| Priced to | call on 2035-05-20 |